8487.90.00/Semiconductor Wafer Polishing Pad/Mexico

Semiconductor Wafer Polishing Pad from Mexico

Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment. 8487.90.00 for non-electrical machinery parts.

Duty Rate — Mexico → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Require CMP-specific pad specifications including slurry compatibility and removal rate data

• Confirm no embedded sensors or electrical features

• Common error: classification as general abrasive under Chapter 68

Semiconductor Wafer Polishing Pad from Mexico — Import Duty Rate | HTS 8487.90.00