Semiconductor Wafer Polishing Pad from Germany
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment. 8487.90.00 for non-electrical machinery parts.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Require CMP-specific pad specifications including slurry compatibility and removal rate data
• Confirm no embedded sensors or electrical features
• Common error: classification as general abrasive under Chapter 68