Double-Sided Wafer Lapper Ring Carrier from Germany
Thin ring carrier that holds multiple semiconductor wafers between upper/lower lapping plates for simultaneous double-sided lapping. Ensures uniform material removal across wafer batch. 8487.90.00 for non-electrical processing parts.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document carrier thickness tolerances and wafer slot dimensions
• Verify material compatibility with lapping slurries
• Pitfall: classification as general fixture under 7326