Double-Sided Wafer Lapper Ring Carrier from Canada
Thin ring carrier that holds multiple semiconductor wafers between upper/lower lapping plates for simultaneous double-sided lapping. Ensures uniform material removal across wafer batch. 8487.90.00 for non-electrical processing parts.
Duty Rate — Canada → United States
13.9%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document carrier thickness tolerances and wafer slot dimensions
• Verify material compatibility with lapping slurries
• Pitfall: classification as general fixture under 7326