Crystal Ingot Trimming Saw Arbor from Japan
Rotating arbor assembly that holds diamond saw blades for precision trimming of semiconductor crystal ingot ends before boule processing. Mechanical drive shaft component without electrical features. 8487.90.00 classification for unspecified parts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide arbor balance specifications and RPM ratings for semiconductor saws
• Ensure blade mounting interface matches wafer saw equipment
• Avoid tool classification under 8467