Wafer Slicing Saw Coolant Distributor from Mexico
Manifold distributing coolant to diamond saw blade during semiconductor wafer slicing from ingots. Classifies HTS 8487.90.0080 as part of wafer manufacturing saws. Maintains blade cooling for thin kerf cuts.
Duty Rate — Mexico → United States
28.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document blade cooling requirements (10-20 L/min)
• Specify ID/OD saw compatibility