8487.90.00.80/Wafer Slicing Saw Coolant Distributor/Japan

Wafer Slicing Saw Coolant Distributor from Japan

Manifold distributing coolant to diamond saw blade during semiconductor wafer slicing from ingots. Classifies HTS 8487.90.0080 as part of wafer manufacturing saws. Maintains blade cooling for thin kerf cuts.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document blade cooling requirements (10-20 L/min)

• Specify ID/OD saw compatibility

Wafer Slicing Saw Coolant Distributor from Japan — Import Duty Rate | HTS 8487.90.00.80