Wafer Polisher Slurry Distributor Arm from Mexico
Articulating arm delivering chemical slurry uniformly across polishing pad in semiconductor wafer polishers. Under HTS 8487.90.0080 as mechanical part of CMP equipment. Ensures consistent material removal rates.
Duty Rate — Mexico → United States
28.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document slurry flow uniformity specs across pad surface
• Specify polisher platen size compatibility