Wafer Polisher Slurry Distributor Arm from Germany
Articulating arm delivering chemical slurry uniformly across polishing pad in semiconductor wafer polishers. Under HTS 8487.90.0080 as mechanical part of CMP equipment. Ensures consistent material removal rates.
Duty Rate — Germany → United States
28.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document slurry flow uniformity specs across pad surface
• Specify polisher platen size compatibility