Wafer Polisher Slurry Distributor Arm from Germany
Articulating arm delivering chemical slurry uniformly across polishing pad in semiconductor wafer polishers. Under HTS 8487.90.0080 as mechanical part of CMP equipment. Ensures consistent material removal rates.
Duty Rate — Germany → United States
13.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document slurry flow uniformity specs across pad surface
• Specify polisher platen size compatibility