Wafer Lapping Plate from Germany
Cast iron or ceramic plate used in wafer lappers to achieve flatness tolerances on semiconductor wafers prior to polishing. Classifies in HTS 8487.90.0080 as a component of wafer preparation apparatus for semiconductor device fabrication. Ensures surface planarity critical for lithography processes.
Duty Rate — Germany → United States
28.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify flatness specs (e.g
• <1 micron) and semiconductor material compatibility in import docs
• Provide lapping machine OEM part numbers for classification verification