8487.90.00.80/Wafer Lapping Plate/Germany

Wafer Lapping Plate from Germany

Cast iron or ceramic plate used in wafer lappers to achieve flatness tolerances on semiconductor wafers prior to polishing. Classifies in HTS 8487.90.0080 as a component of wafer preparation apparatus for semiconductor device fabrication. Ensures surface planarity critical for lithography processes.

Duty Rate — Germany → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify flatness specs (e.g

• <1 micron) and semiconductor material compatibility in import docs

• Provide lapping machine OEM part numbers for classification verification

Wafer Lapping Plate from Germany — Import Duty Rate | HTS 8487.90.00.80