Wafer Lapping Plate from China
Cast iron or ceramic plate used in wafer lappers to achieve flatness tolerances on semiconductor wafers prior to polishing. Classifies in HTS 8487.90.0080 as a component of wafer preparation apparatus for semiconductor device fabrication. Ensures surface planarity critical for lithography processes.
Duty Rate — China → United States
38.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify flatness specs (e.g
• <1 micron) and semiconductor material compatibility in import docs
• Provide lapping machine OEM part numbers for classification verification