8487.90.00.80/Wafer Grinding Spindle/Canada

Wafer Grinding Spindle from Canada

Precision spindle assembly for wafer grinders that holds grinding wheels for back-thinning semiconductor wafers to final thickness. HTS 8487.90.0080 as machinery part for semiconductor wafer preparation without electrical connectors. Achieves <50 micron wafer thickness.

Duty Rate — Canada → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify runout tolerances (<1 micron) proving semiconductor precision requirements

• Include vibration damping specs distinguishing from general spindles

Wafer Grinding Spindle from Canada — Import Duty Rate | HTS 8487.90.00.80