Wafer Edge Grinding Ring from Mexico
Specialized ring tool for wafer edge grinders that profiles semiconductor wafer edges to prevent chipping during handling. HTS 8487.90.0080 covers as part of semiconductor wafer preparation equipment. Creates chip-resistant rounded edges.
Duty Rate — Mexico → United States
13.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge profile geometries (e.g
• full arc, truncated pyramid)
• Include wafer size compatibility (200mm, 300mm, 450mm)