8487.90.00.80/Wafer Edge Grinding Ring/Japan

Wafer Edge Grinding Ring from Japan

Specialized ring tool for wafer edge grinders that profiles semiconductor wafer edges to prevent chipping during handling. HTS 8487.90.0080 covers as part of semiconductor wafer preparation equipment. Creates chip-resistant rounded edges.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge profile geometries (e.g

• full arc, truncated pyramid)

• Include wafer size compatibility (200mm, 300mm, 450mm)

Wafer Edge Grinding Ring from Japan — Import Duty Rate | HTS 8487.90.00.80