Semiconductor Wafer Slicing Saw Blade from China
A diamond-impregnated blade designed for inner-diameter saws that slice ultra-thin wafers from monocrystalline semiconductor boules like silicon. Classified under HTS 8487.90.0080 as a part of wafer preparation machinery in semiconductor manufacturing, lacking electrical features. Ensures precise cuts for subsequent device fabrication.
Duty Rate — China → United States
38.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide saw machine specifications confirming diamond blade compatibility for semiconductor use to secure this classification
• Document wafer thickness tolerances (e.g
• <100 microns) to distinguish from general saw blades