8487.90.00.80/CMP Polishing Head Retaining Ring/Japan

CMP Polishing Head Retaining Ring from Japan

Consumable retaining ring for chemical mechanical polishing heads that contains slurry and wafer during planarization. Under HTS 8487.90.0080 as part of semiconductor wafer polishing machinery. Engineered for uniform pressure distribution.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document polish rates, ring materials (e.g

• PPS, carbon composite)

• Specify carrier head model compatibility

CMP Polishing Head Retaining Ring from Japan — Import Duty Rate | HTS 8487.90.00.80