CMP Polishing Head Retaining Ring from Germany
Consumable retaining ring for chemical mechanical polishing heads that contains slurry and wafer during planarization. Under HTS 8487.90.0080 as part of semiconductor wafer polishing machinery. Engineered for uniform pressure distribution.
Duty Rate — Germany → United States
28.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document polish rates, ring materials (e.g
• PPS, carbon composite)
• Specify carrier head model compatibility