CMP Polishing Head Retaining Ring from Germany
Consumable retaining ring for chemical mechanical polishing heads that contains slurry and wafer during planarization. Under HTS 8487.90.0080 as part of semiconductor wafer polishing machinery. Engineered for uniform pressure distribution.
Duty Rate — Germany → United States
28.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document polish rates, ring materials (e.g
• PPS, carbon composite)
• Specify carrier head model compatibility