8486.90.00.00/Wafer Grinder Lapping Plate/China

Wafer Grinder Lapping Plate from China

A precision copper or tin lapping plate used in wafer grinders to achieve flatness tolerances on semiconductor wafers during preparation for fabrication. Covered under HTS 8486.90.00.00 per statistical note for wafer grinders, lappers, and polishers.

Duty Rate — China → United States

25%

Rate breakdown

9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Obtain flatness certification (<0.1 micron) from supplier; ensure compliance with cleanroom material standards; pitfall is classifying as general abrasives under 6804

Wafer Grinder Lapping Plate from China — Import Duty Rate | HTS 8486.90.00.00