Wafer Grinder Lapping Plate from Canada
A precision copper or tin lapping plate used in wafer grinders to achieve flatness tolerances on semiconductor wafers during preparation for fabrication. Covered under HTS 8486.90.00.00 per statistical note for wafer grinders, lappers, and polishers.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Obtain flatness certification (<0.1 micron) from supplier; ensure compliance with cleanroom material standards; pitfall is classifying as general abrasives under 6804