8486.90.00.00/Wafer Edge Profiling Tool/Japan

Wafer Edge Profiling Tool from Japan

Diamond wheel tool for creating beveled edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8486.90.00.00 as accessory for wafer preparation equipment.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify bevel angle (typically 45°) and radius specs; ensure diamond bonding material certification; distinguish from jewelry grinding wheels under 8207