Wafer Edge Profiling Tool from Germany
Diamond wheel tool for creating beveled edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8486.90.00.00 as accessory for wafer preparation equipment.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify bevel angle (typically 45°) and radius specs; ensure diamond bonding material certification; distinguish from jewelry grinding wheels under 8207