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8486.90.00.00/Wafer Edge Profiling Tool/China

Wafer Edge Profiling Tool from China

Diamond wheel tool for creating beveled edges on semiconductor wafers to prevent chipping during handling and processing. HTS 8486.90.00.00 as accessory for wafer preparation equipment.

Duty Rate — China → United States

25%

Rate breakdown

9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
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Import Tips

• Specify bevel angle (typically 45°) and radius specs; ensure diamond bonding material certification; distinguish from jewelry grinding wheels under 8207

Wafer Edge Profiling Tool from China — Import Duty Rate | HTS 8486.90.00.00