Silicon Wafer Slicing Diamond Wire from Mexico
A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers, as specified in the statistical note under wafer slicing saws. Classified under HTS 8486.90.00.00 as an essential accessory for wafer preparation equipment.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Require supplier specs on diamond grit size and wire tension compatibility; check for slurry compatibility documentation; avoid pitfalls by distinguishing from general cutting wires under 8207