8486.90.00.00/Silicon Wafer Slicing Diamond Wire/Japan

Silicon Wafer Slicing Diamond Wire from Japan

A diamond-impregnated wire used in multi-wire saws to slice semiconductor boules into thin wafers, as specified in the statistical note under wafer slicing saws. Classified under HTS 8486.90.00.00 as an essential accessory for wafer preparation equipment.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Require supplier specs on diamond grit size and wire tension compatibility; check for slurry compatibility documentation; avoid pitfalls by distinguishing from general cutting wires under 8207

Silicon Wafer Slicing Diamond Wire from Japan — Import Duty Rate | HTS 8486.90.00.00