Mask Reticle Repair Workstation from Japan

Advanced system using focused ion beam (FIB) technology to repair defects in photomasks and reticles by milling and deposition. Qualifies for HTS 8486.40.0010 due to its specific application in mask and reticle repair for semiconductor fabrication.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

Import Tips

Include FIB resolution specifications (<10nm) and repair process documentation

Demonstrate exclusive use for semiconductor masks vs general material processing

Watch for classification challenges when system includes multiple repair modalities