Mask Reticle Repair Workstation from China
Advanced system using focused ion beam (FIB) technology to repair defects in photomasks and reticles by milling and deposition. Qualifies for HTS 8486.40.0010 due to its specific application in mask and reticle repair for semiconductor fabrication.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include FIB resolution specifications (<10nm) and repair process documentation
• Demonstrate exclusive use for semiconductor masks vs general material processing
• Watch for classification challenges when system includes multiple repair modalities