</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8486.20.00.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. Classified in HTS 8486.20.00.00 as apparatus for semiconductor device manufacture per statistical notes. Ensures surface planarity critical for photolithography.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify flatness tolerances (e.g

• <1 micron) for classification support; require slurry chemical compatibility certs; test for vibration-free operation in cleanrooms

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8486.20.00.00