Wafer Lapping Machine from Germany
Wafer lapping machines grind and polish semiconductor wafers to precise flatness and thickness tolerances required before fabrication processes. Classified in HTS 8486.20.00.00 as apparatus for semiconductor device manufacture per statistical notes. Ensures surface planarity critical for photolithography.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify flatness tolerances (e.g
• <1 micron) for classification support; require slurry chemical compatibility certs; test for vibration-free operation in cleanrooms