Wafer Edge Grinding Machine from China
Specialized grinders profile semiconductor wafer edges to prevent chipping and ensure handling safety during fabrication. Classified HTS 8486.20.00.00 as wafer preparation equipment for device manufacture. Achieves precise edge geometry for automated processing.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide edge profile specs (e.g
• chamfer angles); document diamond wheel specifications; ensure ESD-safe materials