Wafer Annealing Oven from China
Rapid thermal annealing ovens activate dopants and repair lattice damage in semiconductor wafers post-implantation. Under HTS 8486.20.00.00 as semiconductor manufacturing apparatus. Provides precise temperature ramps.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Ramp rate/temperature uniformity specs; inert gas flow documentation; cleanroom thermal profiles