Semiconductor Wafer Slicing Saw from Germany
Wafer slicing saws precisely cut monocrystalline semiconductor boules into thin wafers for device fabrication, using diamond wire or blades. This apparatus is classified under HTS 8486.20.00.00 as essential for semiconductor manufacturing processes. It ensures minimal material loss and precise wafer thickness for IC production.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide wafer thickness/tolerance specs proving semiconductor precision; ensure saw blade materials comply with cleanroom standards; avoid classification as general diamond saws