Semiconductor Wafer Metrology Tool from China
In-line metrology tools measure wafer thickness, overlay, and critical dimensions during device manufacturing for process control. Borderline HTS 8486.20.00.00 if integral to fabrication. Distinguish from pure testing in Chapter 90.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Prove process control vs pure testing function; resolution/throughput specs; integration documentation