Wafer Slicing Diamond Saw from Japan
A wafer slicing diamond saw cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. HTS 8486.10.00.00 covers this as boule-to-wafer slicing apparatus.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Certify blade diamond content and slicing thickness (<500μm) for proper heading
• Document integration with cleanroom standards to support semi-specific use