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8486.10.00.00/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

A wafer slicing diamond saw cuts thin wafers from monocrystalline semiconductor boules using a diamond-impregnated blade for minimal kerf loss and high precision. It is essential for wafer preparation in chip manufacturing. HTS 8486.10.00.00 covers this as boule-to-wafer slicing apparatus.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Certify blade diamond content and slicing thickness (<500μm) for proper heading

• Document integration with cleanroom standards to support semi-specific use

Wafer Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8486.10.00.00