Silicon Wafer Polishing Machine from China
A silicon wafer polishing machine uses chemical-mechanical planarization (CMP) to create mirror-finish wafer surfaces for semiconductor lithography. It brings wafers to final tolerances before fab processing. Classified in HTS 8486.10.00.00 as wafer preparation apparatus.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide CMP slurry compatibility details to confirm wafer-specific design
• Include cleanroom class ratings (e.g
• ISO 3) in technical files