Silicon Crystal Grinder from China
A silicon crystal grinder processes semiconductor boules by grinding them to precise diameters and creating flats that indicate conductivity type and resistivity. It prepares the boule for wafer slicing in semiconductor fabrication. This falls under HTS 8486.10.00.00 as wafer preparation equipment.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Label with exact tolerances (e.g
• diameter ±0.1mm) to prove semiconductor precision
• Pair with boule puller invoices for context in supply chain classification