SEMI Wafer Grinder-Polisher Combo from China
A combo grinder-polisher performs sequential grinding and polishing in one station for semiconductor wafers, optimizing throughput. Integrated per statistical note. HTS 8486.10.00.00.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Process sequence documentation
• Throughput specs (wafers/hour)
• Separate units may classify differently