Precision Wafer Slicer from Germany
A precision wafer slicer uses inner-diameter diamond saws for kerfless wafering from semiconductor boules. Minimizes waste for thin wafers. HTS 8486.10.00.00.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Kerf loss data (<100μm)
• Wafer thickness capability