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8486.10.00.00/Precision Wafer Slicer/Germany

Precision Wafer Slicer from Germany

A precision wafer slicer uses inner-diameter diamond saws for kerfless wafering from semiconductor boules. Minimizes waste for thin wafers. HTS 8486.10.00.00.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Kerf loss data (<100μm)

• Wafer thickness capability