Precision Wafer Slicer from China
A precision wafer slicer uses inner-diameter diamond saws for kerfless wafering from semiconductor boules. Minimizes waste for thin wafers. HTS 8486.10.00.00.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Kerf loss data (<100μm)
• Wafer thickness capability