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8486.10.00.00/Double-Sided Wafer Grinder/Japan

Double-Sided Wafer Grinder from Japan

A double-sided wafer grinder simultaneously processes both wafer faces to achieve parallel thickness control essential for device uniformity. Uses planetary motion with diamond pads. HTS 8486.10.00.00 for wafer grinding.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
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Import Tips

• Thickness variation specs (<1μm) key for docs

• SEMI compliance certification helps

Double-Sided Wafer Grinder from Japan — Import Duty Rate | HTS 8486.10.00.00