Double-Sided Wafer Grinder from China
A double-sided wafer grinder simultaneously processes both wafer faces to achieve parallel thickness control essential for device uniformity. Uses planetary motion with diamond pads. HTS 8486.10.00.00 for wafer grinding.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Thickness variation specs (<1μm) key for docs
• SEMI compliance certification helps