Double-Sided Wafer Grinder from Canada
A double-sided wafer grinder simultaneously processes both wafer faces to achieve parallel thickness control essential for device uniformity. Uses planetary motion with diamond pads. HTS 8486.10.00.00 for wafer grinding.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Thickness variation specs (<1μm) key for docs
• SEMI compliance certification helps