8486.10.00.00/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

A chemical mechanical wafer polisher (CMP) uses slurry and pad to planarize wafers for sub-micron flatness in advanced nodes. Includes in-situ endpoint detection. Classified HTS 8486.10.00.00 as wafer polisher.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Detail slurry chemistry and pressure control

• Endpoint detection system specs

Chemical Mechanical Wafer Polisher from Japan — Import Duty Rate | HTS 8486.10.00.00