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8486.10.00.00/Chemical Mechanical Wafer Polisher/Germany

Chemical Mechanical Wafer Polisher from Germany

A chemical mechanical wafer polisher (CMP) uses slurry and pad to planarize wafers for sub-micron flatness in advanced nodes. Includes in-situ endpoint detection. Classified HTS 8486.10.00.00 as wafer polisher.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Detail slurry chemistry and pressure control

• Endpoint detection system specs