Chemical Mechanical Wafer Polisher from Canada
A chemical mechanical wafer polisher (CMP) uses slurry and pad to planarize wafers for sub-micron flatness in advanced nodes. Includes in-situ endpoint detection. Classified HTS 8486.10.00.00 as wafer polisher.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Detail slurry chemistry and pressure control
• Endpoint detection system specs