8482.99.25/Stainless Steel Outer Bearing Race for Semiconductor Wafer Slicers/China

Stainless Steel Outer Bearing Race for Semiconductor Wafer Slicers from China

Precision-machined stainless steel outer race designed for high-speed ball bearings in wafer slicing saws used in semiconductor manufacturing. It provides the rolling surface for balls in bearings that support the saw blade during thin wafer cuts from silicon boules. Classified under 8482.99.25 as an other inner or outer ring or race for specialized industrial applications.

Duty Rate — China → United States

40.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Verify material composition and dimensional tolerances via manufacturer specs to confirm classification as a bearing race, not a complete bearing

• Include detailed engineering drawings in documentation to prove use in high-precision machinery like semiconductor slicers

• Avoid misclassification as machinery parts (8487) by emphasizing standalone function as a bearing component