Nano-Polished Inner Ring for Semiconductor Wafer Lappers from Japan
Nano-surface finished inner ring for air-bearing spindles in wafer lappers, achieving sub-micron flatness for semiconductor device fabrication readiness. Minimizes subsurface damage in lapping process. HTS 8482.99.25 for precision other bearing rings.
Duty Rate — Japan → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include SEM micrographs or profilometer data proving nano-finish for classification support
• Declare as replacement parts for lappers under semiconductor statistical provisions
• Avoid 9031 classification by confirming not integral to measuring functions