Nano-Polished Inner Ring for Semiconductor Wafer Lappers from China
Nano-surface finished inner ring for air-bearing spindles in wafer lappers, achieving sub-micron flatness for semiconductor device fabrication readiness. Minimizes subsurface damage in lapping process. HTS 8482.99.25 for precision other bearing rings.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include SEM micrographs or profilometer data proving nano-finish for classification support
• Declare as replacement parts for lappers under semiconductor statistical provisions
• Avoid 9031 classification by confirming not integral to measuring functions