Nano-Polished Inner Ring for Semiconductor Wafer Lappers from Canada
Nano-surface finished inner ring for air-bearing spindles in wafer lappers, achieving sub-micron flatness for semiconductor device fabrication readiness. Minimizes subsurface damage in lapping process. HTS 8482.99.25 for precision other bearing rings.
Duty Rate — Canada → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include SEM micrographs or profilometer data proving nano-finish for classification support
• Declare as replacement parts for lappers under semiconductor statistical provisions
• Avoid 9031 classification by confirming not integral to measuring functions