Ceramic-Coated Outer Race for Wafer Grinder Spindles from Japan
Advanced ceramic-coated steel outer race for angular contact ball bearings in wafer grinders, ensuring minimal particle generation during crystal boule diameter grinding. Critical for achieving precise flats indicating conductivity type in semiconductor wafers. HTS 8482.99.25 covers such specialized other bearing races.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include coating specifications and cleanroom compatibility certs to avoid generic steel part classification
• Use invoices specifying semiconductor statistical note applications for accurate duty assessment
• Prevent pitfalls by separating from full grinder machines to maintain 8482 classification