Carbide-Enhanced Inner Race for Wafer Slicing Spindles from Japan
Tungsten carbide insert inner race for diamond wafer slicing saw bearings, providing extreme wear resistance during continuous silicon wafer production. Maintains spindle precision for uniform wafer thickness. Under 8482.99.25 as other bearing rings.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document carbide content percentage to prevent undervaluation or material misclassification
• Specify diamond saw integration in end-use statements per statistical notes
• Separate from saw assemblies to retain 8482 over 8460/8479 saw machine parts